Multi-Layer PCB Design & Signal Integrity

Controlled impedance stackups, differential pair routing for USB/Ethernet/CAN, and length tuning for high-speed digital lines.

• Microstrip & stripline impedance calculations (50Ω single-ended, 90Ω/100Ω differential)
• Unbroken ground reference planes minimizing return path loop inductances
• Rigid-flex and high-density interconnect (HDI) compatibility

Design practices engineered from day one to pass radiated emissions, conducted immunity, and ESD testing on the first spin.

• Stitching vias and guard traces around sensitive analog and RF traces
• Power plane decoupling with low-ESR ceramic caps positioned adjacent to IC pins
• Ferrite bead filtering and TVS diode protection on all exposed I/O connectors

Full manufacturing documentation audited against JLCPCB, PCBWay, and Tier-1 fab house manufacturing design rules.

• Complete Gerber RS-274X and ODB++ packages with drill tables and stackup drawings
• Interactive HTML BOM (iBOM) and pick-and-place centroid coordinates (CPL)
• Alternate component sourcing strategies to avoid supply chain obsolescence

Heavy copper layers, thermal via arrays under power MOSFETs, and voltage drop minimization across power rails.

• Low-loss copper plane fills for high-current motor drivers and battery rails (2oz / 3oz)
• Thermal relief and copper pour balance preventing board warpage during reflow
• DC-DC buck/boost converter layout with minimal switching loop area